中文Page Copyright: Huizhou Dayawan Huaxin New Material Co., Ltd. | 粤ICP备18091612号 | Website:www.300.cnShenzhen
FAX：0752-5830286
TEL：0752-5830288
Chengsong Industrial Park, Longxing Road, West District, Dayawan District, Huizhou City, Guangdong Province
E_mail：huaxin0762@sohu.com
专业UV领域研发生产制造企业
Professional UV research and development manufacturing company
LCD, LCM module fixed UV glue
LCD, LCM module fixed UV glue
This product has excellent bonding strength to LCD pins, LCD glass panels, plastics, glass, metal and other materials. It has fast curing speed, fast drying, low shrinkage and high strength. It is resistant to boiling water and pollution. High temperature resistance, no solvent, high transparency after curing, no atomization, no whitening, no yellowing, excellent electrical insulation properties and sealing performance, suitable for automated assembly. This product is a one-component, 100% solid content, no corrosion to the substrate, through SGS, RoHS environmental protection specifications.
|
Product performance and number |
UV 4056-1 |
UV 414-1 |
|
Appearance |
Light green liquid |
Light green liquid |
|
Viscosity @ (25℃, cPs) |
22000-24000 cps |
14000-16000cps |
|
Tensile Strength (psi) ASTM D882 |
4680 |
5986 |
|
Pulling modulus (psi) ASTM D882 |
39538 |
68329 |
|
High and low temperature test, high temperature 100 ° C, low temperature -40 ° C, cycle 100 times, 1 hour each time |
No significant changes |
No significant changes |
|
High humidity resistance test: temperature 85 ° C, relative humidity 85% -100%, time 24 hours |
No significant changes |
No significant changes |
|
Salt spray resistance test |
No significant changes |
No significant changes |
|
Dielectric constant（1 MHz） |
3.9 |
3.9 |
|
Dielectric loss（1 MHz） |
0.03 |
0.03 |
|
Dielectric strength（KV/MM） |
27 |
27 |
|
Surface resistivity (ohms) |
4.0*1016 |
4.0*1016 |
|
Table volume resistivity (ohms) |
1.3*1016 |
1.3*1016 |
|
Hardness(D) ASTM D2240 |
82D |
80D |
|
Water absorption (%) ASTM D570 |
0.01 |
0.01 |
|
Curing shrinkage |
0.01% |
0.01% |
|
Curing energy |
500-800mj/cm2 |
500-800mj/cm2 |